We can provide Physical Design and Full Custom Layout e.g. Circuit layout, floor planning and routing etc.
The IC Failure Analysis Laboratory (IC FAL) provides laboratory services with advanced test equipment to support the product analysis.
HMIC is an important and significant step towards the integration and miniaturization of the microwave subsystems and systems.
our mechanical design services leverage the best tools and practices to ensure reliably excellent manufacturing outcomes.
NIDC's core business is custom IC design services e.g. Schematic entry and simulation: device level, behavioral level, noise analysis, statistical analysis and circuit optimization, Behavioral and RTL model development, Test bench development and design verification, Logic Design and Synthesis, Design-for-Test (Scan, JTAG, CTAG and BIST), ATPG and Test Program Development, Power analysis and optimization.
Our lab is equipped and staffed for IC failure analysis services aimed at a fast turnaround and accurate results. The IC Failure Analysis Laboratory (IC FAL) provides laboratory services with advanced test equipment to support the product analysis for semiconductor devices and electronic products. The following two type of failure analysis techniques are performed: Non-Destructive Testing (NDT): It refers to an array of inspection methods that allow inspectors to evaluate and collect data about a material, system, or component without permanently altering it. Destructive Testing (DT):
Our RTOS Design team at NECOP utilizes best in class RTOS for connected resource-constrained devices build to be modular, secure, and safe. Our goal is to implement a small-footprint kernel designed for embedded systems that can support multiple architectures such as RISC-V, ARM, Intel x86 and MIPS.
NECOP design center is establishing state-of-the-art Microwave Hybrid Assembly Line & Low Temperature Co-fired Ceramics (LTCC) Facility that will fulfill all the requirement of hybrid microwave integrated circuits (HMIC) Prototyping. The facility will be available at the end of year 2023. HMIC is an important and significant step towards the integration and miniaturization of the microwave subsystems and systems. It is an electronic packaging & interconnection approach that combines multiple ICs to offer a specific circuit function.
Bringing a product idea to market is never an easy process and every product development/commercialization journey is unique. The ability to form a product development team with deep domain knowledge and access to advanced tools and infrastructure, with a defined and documented product realization process is key to navigating the new product development and new product design journey successfully. NECOP’s multi-disciplinary Mechanical Design & Development team comprised of dedicated research, design, and engineering professionals build lasting relationships by partnering with clients to transform breakthrough contract product designs and innovations into reality.
Necop is Pioneer in providing Technical Training Sessions.
